New Delhi
Union Minister Ashwini Vaishnav has approved four new semiconductor projects. He said that four new semiconductor projects have been approved. As already 6 projects are already approved and today four new projects have been added to it. They are in Odisha, Andhra Pradesh and Punjab. They will invest Rs 4,594 crore. The government said that SCSEM, Continental device India (CDIL), 3D glass solutions and advanced systems in package (ASIP) technologies will produce an estimated 2,034 skill based jobs and many indirect jobs. With this, the total number of projects under the mission has increased to 10, which shows an investment of about Rs 1.60 lakh crore in six states.
SCSEM will form India’s first commercial compound semiconductor Fab in association with the British-based Clas-Sic Wafer Fab. 3D Glass Solutions will build a modern packaging and embedded glass substrate plant, while ASIP will create a semiconductor package in collaboration with South Korea’s APACT. CDIL will produce high power equipment by expansion.
The government said that these projects would support the increasing demand in telecom, automotive, data centers, consumer electronics and industrial sectors, which will promote its “self -sufficient India” campaign.
